Infrared sensor package

ABSTRACT

An infrared sensor package has a dielectric support which is molded from a plastic material to have a sensor mount for securing a pyroelectric element as well as an IC mount for securing an IC chip that processes a signal from the pyroelectric element. The support is molded over to be integral with metal parts. The metal parts include sensor conductors for interconnection of the pyroelectric element with the IC chip, and I/O conductors for interconnection of the IC chip with I/O pins. The sensor conductors as well as the I/O conductors are both molded into and integrally with the dielectric support.

TECHNICAL FIELD

[0001] The present invention is directed to an infrared sensor package,and more particularly to an infrared sensor package of a self-containedtype incorporating a pyroelectric element as well as an IC chip whichprocesses a signal output from the element for providing a determinedsensor output.

BACKGROUND ART

[0002] U.S. Pat. No. 6,121,614 discloses an infrared sensor of the aboveself-contained type having a dielectric support on which thepyroelectric element as well as the IC chips are mounted. The support isheld within a space between a base and a cover. The base has I/O pinsthat are connected to the IC chip and projects for connection with anexternal circuit. In order to electrically connect the IC chip to thepyroelectric element, external electric parts, and the I/O pins, thesupport of generally cuboid configuration is formed with a complexconductor pattern extending across two or more outer surfaces of thesupport. However, the conductor pattern can be only realized throughseveral processes with the use of specific facilities, which makes itdifficult to make the sensor at a low cost.

DISCLOSURE OF THE INVENTION

[0003] In view of the above problem the present invention has beenachieved to provide an improved infrared sensor package which is capableof being manufactured at a reduced cost, yet retaining compactness. Theinfrared sensor package of the present invention includes a dielectricsupport which is molded from a plastic material to have a sensor mountfor securing a pyroelectric element as well as an IC mount for securingan IC chip that processes a signal from the pyroelectric element. Thesupport is held on a base which is formed with a plurality of I/O pinsextending through the base for electrical connection of the IC chip withan external circuit. A cover is secured to the base to give a spacetherebetween for accommodating the support. The support is formed withsensor conductors for electrical interconnection between thepyroelectric element and the IC chip and also with I/O conductors forelectrical interconnection between the IC chip and the I/O pins. Theimportant feature of the present invention resides in that the sensorconductors and the I/O conductors are molded into and integrally withthe dielectric support. Thus, the sensor conductors as well as the I/Oconductors can be realized by a rather simple manufacturing process tothereby reduce a cost of manufacturing the infrared sensor, whileassuring the electrical connections on the side of the support betweenthe IC chip and the pyroelectric element and between the IC chip and theI/O pins.

[0004] In a preferred embodiment, the support is shaped into a generallycuboid having an upper face, a front face and a lower face. The upperface is formed with the sensor mount, while the front face is formedwith the IC mount. Each of the sensor conductors has portions exposed onthe upper and front faces of the support respectively for connectionwith the pyroelectric element secured to the sensor mount as well as forconnection with the IC chip secured to the IC mount. Each I/O conductorhas portions exposed on the front and lower faces of the supportrespectively for connection with the IC chip and with the I/O pin on thelower face of the support. With this arrangement, the sensor package canbe made compact, while simplifying the patterns of the individualconductors.

[0005] Preferably, a metal-shield is molded into the support in aportion adjacent to the IC mount and connected to a stabilized electricpotential in the circuit of the IC chip for shielding the IC chip at thestabilized electric potential, thereby electromagnetically protectingthe circuit of the IC chip to minimize parasitic capacitance between theinput and output of the IC chip for enhanced reliability of the sensoroutput. In this connection, the metal-shield may be shaped to have avertical segment embedded in the support behind the IC mount and ahorizontal segment bent from the upper end of the vertical segment forshielding the IC chip from the pyroelectric element. This isadvantageous for effectively shielding the IC chip also from thepyroelectric element, yet with the use of the metal shield embedded inthe support.

[0006] The metal-shield may be shaped to have a major portion embeddedbehind the IC mount in the front face and a terminal leg extending fromthe major portion to the front face of the support for connection with aconstant potential portion of the circuit of the IC chip.

[0007] Further, the metal-shield is preferred to have an integralextension which extends behind the sensor mount for shielding thepyroelectric element as well.

[0008] In the preferred embodiment, one of the sensor conductors, whichis responsible for connection with a signal output of the pyroelectricsensor, is located adjacent to the upper face and is spaced diagonallywith respect to the front face from one of the I/O conductors which isconnected to an output of the IC chip. This is advantageous for reducinga possible capacitive coupling between the signal input and the outputof the IC chip for reliable infrared detection.

[0009] Further, the I/O conductor may include a vertical segmentembedded within the support and a horizontal segment extending from thelower end of the vertical segment outwardly of the support for immediateconnection with the I/O pin

[0010] It is also preferred that the support is molded over a firstmetal-shield and a second metal-shield which are spaced from each otheradjacent to the IC mount for shielding the IC chip. The firstmetal-shield is electrically connected to a ground line of the IC chip,while the second metal-shield is electrically connected to a portion ofthe IC chip having an electrical potential higher than the ground line.With the inclusion of the second metal-shield, it is readily possible toreduce a leakage current from the sensor output of the pyroelectricelement, thereby improving reliability of the infrared sensor.

[0011] The sensor conductors may be respectively formed with pads thatproject on the support for electrical connection with electrodes of thepyroelectric element by means of electrically conductive adhesives.

[0012] The support is formed with a concavity for receiving therein anexternal electric component to be connected to the circuit of the ICchip. A pair of component terminals is molded into the support withportions thereof exposed to a bottom of the concavity for contact withthe external electric component and for electrical interconnection ofthe component to the IC chip. Thus, the necessary electronic componentexternal to the IC chip can be successfully incorporated into thesupport together with the IC chip, making the whole assembly compact. Inthis connection, the component terminals have their respective portionsexposed to a bottom of the concavity receiving the IC chip forelectrical interconnection of the external electric component to the ICchip.

[0013] In another embodiment of the present invention, the support isconfigured as a generally flat plate having a top face and a bottom facewhich are formed respectively with the sensor mount and the IC mount. Inthis case, each sensor conductor has portions exposed on the top andbottom faces of the support for interconnection between the pyroelectricelement and the IC chip, while each I/O conductor has portions exposedon the bottom face of the support for interconnection between the ICchip and the I/O pins. Thus, the pyroelectric element, the IC chip andthe I/O pins can be successfully supported on the flat support andelectrically connected to each other with the use of the conductorsembedded in the support.

[0014] In this case, the sensor conductor and the I/O conductors can beshaped into flat plates embedded in the support between the sensor mountand the IC mount. With the use of the flat-shaped sensor conductors andthe I/O conductors, it is possible to make the electricalinterconnection without relying upon extra bending works on the embeddedconductors, therefore reducing the manufacturing cost.

[0015] Further, the sensor mount and the IC mount may be recessesrespectively formed in the top and bottom faces for accommodatingtherein the pyroelectric element and the IC chip.

[0016] Each of the I/O pins may be formed integrally with eachassociated one of the I/O conductors. That is, the I/O conductor moldedin the support may be provided integrally with the I/O pin for reducinga number of components.

[0017] The sensor conductors have pads exposed to the sensor mount forsupporting the pyroelectric element in the form of a plate. That is, thepyroelectric element may bridge across the pads to be electricallyconnected as well as mechanically supported thereto. This bridge supportensures sufficient thermal isolation of the pyroelectric element fromthe support or the IC chip for reliable sensing performance. Preferably,the sensor mount is in the form of a concavity formed in the support toexpose the pads on the bottom of the concavity.

[0018] When the IC mount is in the form of a recess, the recess isshaped to have a bottom and a mouth which is greater than the bottom.This is advantageous for facilitating to make wire bonding between theIC chip and the sensor conductors and/or the I/O terminals, i.e.,accommodating the entry of a capillary head used in the wire bonding.

[0019] Further, the support may be formed with holes for receivingtherein the respective I/O pins. Each I/O conductor has a portionexposed in each hole for electrical interconnection with the I/O pininserted into the hole.

[0020] These and still other objects and advantageous features of thepresent invention will become more apparent from the followingdescription of the preferred embodiments when taken in conjunction withthe attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0021]FIG. 1 is an exploded perspective view of an infrared sensorpackage in accordance with a preferred embodiment of the presentinvention;

[0022]FIGS. 2 and 3 are perspective views of a major portion of thesensor package respectively viewed from different directions;

[0023]FIG. 4 is a perspective view illustrating an internal structure ofthe package;

[0024]FIG. 5 is a perspective view of metal conductors embedded in aplastic support of the package;

[0025]FIG. 6 is a front view of the support;

[0026]FIG. 7 is a cross-section taken along line 7-7 of FIG. 6;

[0027]FIG. 8 is a cross-section taken along line 8-8 of FIG. 6;

[0028]FIGS. 9A and 9B are respectively top and bottom views of apyroelectric element utilized in the package;

[0029]FIG. 10 is a circuit diagram of the sensor package;

[0030]FIGS. 11A to 11F are perspective views illustrating a process offabricating the sensor package;

[0031]FIGS. 12A to 12D are perspective views illustrating a process offabricating the sensor package;

[0032]FIG. 13 is a perspective view of a modification of the abovesensor package;

[0033]FIGS. 14 and 15 are exploded perspective views of an infraredsensor package in accordance with another embodiment of the presentinvention;

[0034]FIGS. 16 and 17 are perspective views illustrating a plasticsupport of the sensor package respectively viewed from differentdirections;

[0035]FIGS. 18A to 18E are perspective views illustrating a process offabricating the sensor package;

[0036]FIG. 19 is a perspective view of a modification of the aboveembodiment; and

[0037]FIGS. 20 and 21 are perspective views illustrating the supportrespectively as viewed from different directions.

MODE FOR CARRYING OUT THE INVENTION

[0038] Referring now to FIG. 1, there is shown an infrared sensorpackage in accordance with a preferred embodiment of the presentinvention. The infrared sensor package is provided, for example, todetect human presence in the room or area in order to give a warning orcontrol an associated lighting device or the like. The package isbasically composed of a base 10 carrying a dielectric support 20, I/Oterminal pins 11 to 13, and a cover 100 fitted over the support 20 onthe base 10. The dielectric support 20 retains a pyroelectric element30, an IC chip 40 forming a signal processing circuit, and an electroniccomponent 50 to be connected to the circuit of the IC chip 40. Thepyroelectric element 30 generates a signal output upon receivinginfrared radiation through a transparent window 101 in the top of thecover 100. As shown in FIG. 10, the signal processing circuit realizes acurrent-voltage converter 41 for converting the signal output in theform of a current into a voltage, an amplifier 42 for amplifying thevoltage, a digital filter 43 for filtering off noises not originatingfrom other than the human, and an output section 44 including awindow-comparator that compares the filtered voltage with thresholds fordetection of the human presence, and outputs a determined sensor outputindicative of the human presence through an output terminal 45. Inaddition, the circuit includes a power supply 46 which is energized byan external source voltage <VDD> to supply an operating voltage <VR> tothe pyroelectric element 30 as well as other voltages to variousportions of the circuit, and also includes a clock generator 47 thatgives a clock signal to the digital filter 43. The external electroniccomponent 50 is a capacitor of relatively large capacitance which is notincluded in the IC chip 40 and is connected to the circuit thereof.

[0039] As shown in FIGS. 2 and 3, the support 20 is molded from adielectric plastic material into a generally flat cuboid having a narrowtop face and a large front face. The top face is formed with a sensormount 21 for securing the pyroelectric element 30, while the front faceis formed with an IC mount 25 for securing the IC chip 40. The plasticsupport 20 is made from a liquid crystal polymer, and is molded overmetal parts to be integral therewith. That is, the metal parts areembedded partly in the support 20 at the molding thereof. As shown inFIGS. 4 and 5, the metal parts include a pair of sensor conductors 61and 62 for electrically interconnecting the pyroelectric element 30 withthe IC chip 40, three I/O conductors 71 to 73 for electricallyinterconnecting the IC chip 40 respectively with the I/O pins 11 to 13,a pair of component terminals 81 and 82 for electrical interconnectionof the external component 50 with the IC chip 40, and shield plates 90and 95. The shield plate 90 is separated from the other metal parts, andincludes a vertical segment 91, a horizontal segment extending from thetop of the vertical segment, and a terminal lead 93 extendinghorizontally from one side of the vertical segment. The vertical segment91 is embedded in the support 20 at a location behind the upper portionof the IC chip 40 for electromagnetically shielding thereof, while thehorizontal segment 92 is embedded in the support at a location below thepyroelectric element 30 for shielding or electromagnetically isolatingthe IC chip 40 from the pyroelectric element 30. The shield plate 95, onthe other hand, is formed as an integral or continuous member with theI/O conductors 72 as well as the component terminal 82, and includes avertical segment 96 located behind the lower end of the IC chip 40, ahorizontal segment 97 projecting from the lower end of the verticalsegment 96 for shielding the lower end of the IC chip 40, and a sideextension 98 for shielding the side of the IC chip 40. As best shown inFIG. 6, the vertical segment 96 has is major portion exposed on thefront face of the support 20 and is connected to a ground of the IC chip40. In this connection, the I/O conductor 72 integral with the shieldplate 95 is exposed on the bottom of the support for direct contact witha ground conductor 14 at the upper end of the base 10 and iselectrically connected therethrough to the I/O pin 12.

[0040] Turning back to FIGS. 2 and 3, the sensor mount 21 is defined bya pair of shoulders at opposite ends of a cavity formed in the upperface of the support 20. It is the shoulders across which thepyroelectric element 30 bridges (FIG. 1) to be secured to the upper faceof the support 20. The pyroelectric element 30 is composed of adielectric substrate 31 formed on opposite surfaces respectively withlight receiving electrodes 32 and 33. The electrodes 32 and 33 arearranged on the upper surface of the substrate in a pattern (FIG. 9A)and on the lower surface of the substrate in a pattern (FIG. 9B) suchthat four pairs of electrodes 32 and 33 of opposite polarities are givenwith the substrate interposed between the electrodes of each pair. Thesubstrate 30 is formed on its opposed ends with terminals 34 and 35which are connected respectively by means of an electrically conductiveadhesive to pads or the portions of the sensor conductors 61 and 62projecting on the upper face of the support 20.

[0041] The IC mount 25 is in the form of a rectangular recess in thebottom of a window 26 in the front face of support 20 for receivingtherein the IC chip 40, as indicated by dotted lines in FIGS. 1 and 7.The IC chip 40 is secured by an adhesive to the bottom of the recess 25and is electrically connected by the wire bonding technique to theportions of the conductors embedded in the support. As best shown inFIGS. 4 and 6, exposed on the bottom of the window 26 around the recess25 are portions of the sensor conductors 61 and 62, the componentterminals 81 and 82, the vertical segment 96, the terminal lead 93, andthe I/O conductors 71 and 73. It is these portions that are wire-bondedto corresponding terminal leads on the periphery of the IC chip 40. Inthis connection, wall surrounding the window 26 are inclined to give anopening or mouth which is wider than the bottom, as shown in FIGS. 7 and8, thereby facilitating the wire-bonding operations, i.e., easilyaccommodating a capillary head utilized for the wire-bonding.

[0042] The sensor conductor 61 is connected to receive a signal outputfrom the pyroelectric element 30 and is wire-bonded to a signal input<SIN> of the circuit of the IC chip 40, while the circuit gives thesensor output through the output terminal 45 to the I/O conductor 71. Asshown in the figures, the signal input, i.e., the connection to thesensor conductor 61 is spaced diagonally, with respect to the front faceof the support 20, from the sensor output, i.e., the connection to theI/O conductor 71. This spatial arrangement enhances the electricalisolation between the signal output of the pyroelectric element 30 andthe sensor output of the IC chip 40 in cooperation with a uniqueelectromagnetic shielding scheme using two shield plates 90 and 95 ofdifferent potentials. That is, the shield plate 95 adjacent to thesensor output to the I/O conductor 71 is connected to a circuit groundof the circuit of the IC chip 40, while the shield plate 90 adjacent tothe sensor conductor 61 providing the sensor output is connected at theterminal lead 93 to a portion of the IC chip 40 having a constantpotential <VR2> or <VR> raised from the ground, as shown in FIG. 10. Theconstant potential or stabilized voltage is given as a reference voltagewith which the output <SIN> of the pyroelectric element 30 is comparedto determine the human presence. Because of that the shield plates 91and 92 are held at the reference voltage higher than the ground, it ismade to minimize a possible current leak from the output of thepyroelectric element to the IC chip, thus assuring reliable detection.

[0043] The support 20 is also formed in the front face adjacent to thewindow 26 with a concavity 24 into which the external component 50 isinserted and is electrically connected by means of the electricallyconductive adhesive to the portions of the component terminals 81 and 82exposed on the bottom of the concavity 24. The I/O conductors 71 and 73have the respective lower ends bent to give feet which are exposed onthe lower end of the support for connection with the I/O pins 11 and 13on the upper face of the base 10, as shown in FIG. 1.

[0044]FIGS. 11A to 11F and FIGS. 12A to 12D illustrate steps offabricating the infrared sensor package. Firstly, the conductors ormetal parts are formed in a single metal sheet 8 by being stamped outtherefrom (FIG. 11A). Then, the support 20 is molded over the portionsof the metal parts and the IC chip 40 is mounted to the support 20 (FIG.11B), after which the window is filled with an encapsulating composition2 to seal the IC chip therein (FIG. 11C). Subsequently, the externalelectronic component 50 is fitted into the concavity 24 (FIG. 11D), andthe support 20 is removed from a frame of the metal sheet (FIG. 11E),after which the feet of the I/O conductors 71 and 73 are bent (FIG.11F). Then, the support 20 is assembled on the base 10 with the I/Oconductors 71 to 73 connected to the I/O pins 11 and 13 and the groundconductor 14 of the base (FIGS. 12A and 12B). Finally, the pyroelectricelement 30 is secured to the sensor mount 21 on top of the support 20(FIG. 12C), and the cover 100 is placed over the support and sealed tothe base 10 (FIG. 12D).

[0045]FIG. 13 illustrates a modification of the above embodiment inwhich the sensor mount 21 is defined by a pair of stepped shoulderswhich are recessed from the top face of the support by a depthcorresponding to the thickness of the pyroelectric element for stablyreceiving the ends of the pyroelectric element in the stepped shouldersof the sensor mount 21.

[0046] Now referring to FIGS. 14 and 15, there is shown an infraredsensor package in accordance with another preferred embodiment of thepresent invention which is basically similar to the previous embodimentbut is different therefrom specifically in that the support 20A liesflat on the base 10A to realize a low-profile structure. Like parts aredesignated by like reference numerals with a suffix letter of “A”, andno duplicate explanation deemed is made herein.

[0047] The support 20A is molded over metal parts stamped out from asingle metal sheet, and is formed in its upper large surface with asensor mount 21A in the form of a recess and also with a concavity 24Afor the external electronic component 50, and in the lower surface withan IC mount 25A, as shown in FIGS. 16 and 17. The sensor mount 21A isdefined by a pair of stepped shoulders which are formed on opposite endsof a depression 22 and are recessed from the upper face of the support20A. That is, the sensor mount 21A is in the form of a concavity withthe depression 22 in its bottom. Sensor conductors 61A and 62A areembedded flat in the support and have the respective portions exposed onthe shoulders of the sensor mount 21A to define pads respectively forimmediate connection with the terminals of the pyroelectric element 30held on the shoulders. The IC mount 25A is defined by a recess within awindow 26A formed in the lower surface of the support 20A, as shown inFIG. 17. The recess 25A is formed on its width ends respectively withribs 27 between which the IC chip 40 is fitted. Formed on the bottom ofthe window 26A at portions outwardly of the ribs 27 are sections 28where the portions of the sensor conductors 61A and 62A are exposed forconnection with the corresponding terminals of the IC chip 40 by thewire bonding.

[0048] The support 20A include I/O conductors 71A, 72A, and 73A as wellas component terminals 81A and 82A all of which are basically flatplates partly embedded within the support at the molding thereof. Thesemembers have their portions exposed on the bottom of the window 26Aaround the recess 25A for connection with the associated terminals ofthe IC chip 40 by the wire bonding. For this purpose, the window 26A isalso formed on the longitudinal ends of the bottom with sections 29 inwhich portions of the I/O conductors 71A, 72A and 73A are exposed. Thecomponent terminals 81A and 82A are also made flat and have itsrespective portions exposed on the bottom of the concavity 24A forconnection with the component 50 by the conductive adhesive. As shown inFIG. 17, the interior wall of the windows adjacent to the sections 28and 29 are inclined to give an opening or mouth which is wider than thebottom for facilitating the wire-bonding operations.

[0049] As indicated by dotted lines in FIGS. 16 and 17, the componentterminal 82A is integral with the I/O conductor 72A in the like manneras in the previous embodiment. Although not illustrated in the figures,a metal shield or shields for the IC chip and/or the pyroelectricelement may be embedded in the support in the like manner as in theprevious embodiment. Each of the I/O conductors 71A to 73A has a ringwhich is exposed in the wall of each one of the holes 121 to 123 forelectrical contact with each associated one of the I/O pins extendingthrough the holes.

[0050]FIGS. 18A to 18E illustrate steps of fabricating the sensorpackage. A single metal sheet 8A or tape is formed with the metal partsfor plural sets the packages (FIG. 18A). After the support 20A is moldedover the metal parts of each set (FIG. 18B), the IC chip 40 is mountedon the support 20A followed by being connected to the embedded I/Oconductors (FIG. 18C). Then, the IC chip is sealed by the encapsulatingcomposition 2A (FIG. 18D), after which the support 20A is removed fromthe metal sheet (FIG. 18E). Finally, the pyroelectric element 30A aswell as the electric component 50A are secured to the support 20A, andthe support 20A is secured on the base 10A, as shown in FIG. 15.

[0051] FIGS. 19 to 21 illustrate a modified sensor package which isidentical to the above embodiment except that each of I/O pins 11B, 12B,and 13B are formed as an integral part of each corresponding one of theI/O conductors 71B, 72B, and 73B. Like parts are designated by likereference numerals with a suffix letter of “B”, and no duplicateexplanation is made here. The I/O pins are bent downward from the I/Oconductors and extend through the holes in the base 10B.

1. An infrared sensor package comprising: a dielectric support moldedfrom a plastic material, said support being formed with a sensor mountfor securing a pyroelectric element thereon and with an IC mount forsecuring an IC chip that processes a signal from said pyroelectricelement, a base carrying said dielectric support, said base having aplurality of I/O pins extending therethrough for electrical connectionof said IC chip with an external circuit, a cover secured to said baseto provide a space therebetween for accommodating therein dielectricsupport, sensor conductors formed on the side of said support forelectrical interconnection between said pyroelectric element and said ICchip, I/O conductors formed on the side of the said support forelectrical interconnection between said IC chip and said I/O pins,wherein said sensor conductors as well as said I/O conductors are moldedinto and integrally with said dielectric support.
 2. The infrared sensorpackage as set forth in claim 1, wherein said support is a generallycuboid having an upper face, front face adjacent to the upper face, anda lower face, said upper face being formed with said sensor mount, saidfront face being formed with said IC mount, each of said sensorconductor having portions exposed on the upper and front faces of saidsupport respectively for connection with the pyroelectric elementsecured to the sensor mount as well as with the IC chip secured to theIC mount, each of said I/O conductors having portions exposed on thefront and lower faces of said support respectively for connection withthe IC chip and with said I/O pin on the lower face of the support. 3.The infrared sensor package as set forth in claim 1, further including:a metal-shield molded into said support in a portion adjacent to said ICmount and is connected to a stabilized electric potential portion ofsaid IC chip for shielding said IC chip at said stabilized electricpotential.
 4. The infrared sensor package as set forth in claim 3,wherein said metal-shield comprises a vertical segment embedded in saidsupport behind said IC mount and a horizontal segment bent from theupper end of said vertical segment for shielding said IC chip from saidpyroelectric element.
 5. The infrared sensor package as set forth inclaim 4, wherein said horizontal segment is connected to a referencevoltage of the IC chip.
 6. The infrared sensor package as set forth inclaim 2, wherein said metal-shield comprises a major portion embeddedbehind said IC mount in said front face, and a terminal leg extendingfrom said major portion to the front face of said support for connectionwith a constant potential portion of the circuit of said IC chip.
 7. Theinfrared sensor package as set forth in claim 3, wherein saidmetal-shield has an integral extension which extends behind said sensormount for shielding said pyroelectric element from said IC chip.
 8. Theinfrared sensor package as set forth in claim 1, wherein said support isa generally cuboid having an upper face formed with said sensor mountand a front face adjacent to said upper face, said front face beingformed with said IC mount, said sensor conductor for connection with asignal output of said pyroelectric sensor being located adjacent to saidupper face and being spaced diagonally with respect to said front facefrom the I/O conductor connected to a sensor output of said IC chip. 9.The infrared sensor package as set forth claim 1, wherein said supportis a generally cuboid having an upper face formed with said sensor mountand a front face perpendicular to said upper face, said front face beingformed with said IC mount, said I/O conductor including a verticalsegment embedded within said support and a horizontal segment extendingfrom the lower end of said vertical segment outwardly of said supportfor connection with said I/O pin.
 10. The infrared sensor package as setforth in claim 1, further including a first metal-shield and a secondmetal-shield which are molded into said support in a spaced relationfrom each other adjacent to said IC mount for shielding said IC chip,said first metal-shield being electrically connected to a ground line ofsaid IC chip, said second metal-shield being electrically connected to aportion of said IC chip having an electrical potential higher than saidground line.
 11. The infrared sensor package as set forth in claim 1,wherein said sensor conductors are formed at their respective upper endswith pads that project on said support for electrical connection withelectrodes of said pyroelectric element by means of electricallyconductive adhesives.
 12. The infrared sensor package as set forth inclaim 1, wherein said support is formed with a concavity for receivingtherein an external electric component to be connected to a circuit ofsaid IC chip; a pair of component terminals being molded into saidsupport with portions thereof exposed to a bottom of said concavity forcontact with said external electric component and for electricalinterconnection of the external electric component to said IC chip. 13.The infrared sensor package as set forth in claim 1, wherein saidsupport is a generally flat plate having a top face and a bottom face,said top face being formed with said sensor mount, said bottom facebeing formed with said IC mount, each of said sensor conductor havingportions exposed on the top and bottom faces of said supportrespectively for connection with the pyroelectric element secured to thesensor mount as well as with the IC chip secured to the IC mount, eachof said I/O conductors having portions exposed on the bottom face ofsaid support for connection of the IC chip to the I/O pin.
 14. Theinfrared sensor package as set forth in claim 13, wherein said sensormount is a recess in the top face of said support for accommodatingtherein said pyroelectric element, and said IC mount is also a recess inthe bottom face of said support for accommodating therein said IC chip.15. The infrared sensor package as set forth in claim 13, wherein saidsensor conductors and said I/O conductors are respectively formed intoflat plates that are embedded in said support between said sensor mountand said IC mount.
 16. The infrared sensor package as set forth in claim1, wherein each of said I/O pins is formed integrally with eachassociated one of said I/O conductors into a unitary structure.
 17. Theinfrared sensor package as set forth in claim 1, wherein said sensorconductors have pads exposed to said sensor mount, said pyroelectricelement being in the form of a plate bridging across said pads to beelectrically connected as well as mechanically supported thereto. 18.The infrared sensor package as set forth in claim 17, wherein saidsensor mount is in the form of a concavity formed in said support, saidpads being exposed on a bottom of said concavity.
 19. The infraredsensor package as set forth in claim 1, wherein said IC mount is in theform of a recess in said support, said recess having a bottom and amouth which is greater than the bottom.
 20. The infrared sensor packageas set forth in claim 1, wherein said support is formed with holes forreceiving therein said I/O pins respectively, each of said I/Oconductors having a portion exposed respectively in each of said holesfor electrical connection with said I/O pin.